ARCTIC MX-4 (8 g) - Premium Performance Thermal Paste for All Processors (CPU, GPU - PC), Very high Thermal Conductivity, Long Durability, Safe Application, Non-Conductive. With its outstanding performance, the MX-4 is not only an excellent choice for overclockers and enthusiasts, but also for other sapplications that require thermal transmission.
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Le superfici dei chip dei processori e delle basi dei dissipatori sono caratterizzate da microscopiche irregolarità. Questo assicura che il calore della CPU o della GPU venga dissipato in modo rapido ed efficiente.
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The ARCTIC ACTCP00031B MX-4 4G Thermal Compound is a high-quality thermal compound designed for efficient heat dissipation in computers and other electronics. It comes with a spatula for easy application and includes 4 grams of the gray compound. With a viscosity of 870 poise and a density of 2.50 g/cm³, this thermal compound is compatible with universal brands and has a volume resistivity of 3.8 X 1013 Ω-cm. It is suitable for continuous use temperatures ranging from -50 to 150 °C and can handle a maximum fan speed of 1500 RPM. The compact size of 1.2 inches in length, 5.9 inches in height, and 2.8 inches in width makes it convenient to use in various cooling applications.
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Spatolina inclusa. Le superfici dei chip dei processori e delle basi dei dissipatori sono caratterizzate da microscopiche irregolarità. Questo assicura che il calore della CPU o della GPU venga dissipato in modo rapido ed efficiente.
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Thermal Conductivity Easy to Apply. Add to Favorites. Easy to apply. There is a separate area to leave a product review if you wish. Safe Application. We use a variety of different carriers to fulfil orders.
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La pâte thermique a une conductivité thermique de 1 à 4 W/mK. Conductivité thermique : 8.5 W/mK (valeur indicative donnée par le fournisseur, pas par Arctic, voir plus bas). : Pourquoi ARCTIC ne communique-t-il pas les valeurs de conductivité thermique ?.
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MX-4 (incl. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently. ).
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Le superfici dei chip dei processori e delle basi dei dissipatori sono caratterizzate da microscopiche irregolarità. Questo assicura che il calore della CPU o della GPU venga dissipato in modo rapido ed efficiente.
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