Pasta Dissipatore Termico Silicone Grasso Composto a Base di Carbonio Alte Prestazioni

Non-Conductive Thermal Paste Silicone Grease Compound Carbon Based High Performance Non-Conductive (1 PCS) Thermal heatsink paste with a conductivity of 1.93 W/m-k ensures effective dissipation of heat generated by the CPU or GPU. The Thermal Compound with low thermal resistance remains pliable over time. It has a broad operating temperature range, ensuring stable performance in environments from -30℃ to 280℃. With superior heat dissipation and cost-effectiveness, its performance does not degrade over time.

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