Foglio piastra di costruzione in resina epossidica biadesivo per Bambu Lab X1/X1C/P1P/P1S/A1/X1E

Compatible with:For Bambu Lab X1/X1C/P1P/P1S/A1/X1E. Cold-beaten epoxy resin coating, suitable for printing engineering materials such as PLA, PETG, ABS, PA, etc., providing excellent low-temperature printing adhesion, ultra-dense coating, and increased life.

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