Saldatura a flusso in resina senza piombo 1,0 mm SN100C-030-10, superiore, Giappone
● You are using a no-clean Taipuyani. ● and good liquidity. ● alloy composition (tin: 99.24%, copper: 0.7%, Ni: 0.05%, germanium: 0.01% or less). ● retrofitting of the printed circuit board, ideal for modification.