At its core, the 5700X3D leverages TSMC’s 7nm FinFET 工艺 for the CPU compute die (CCD) and GlobalFoundries’ 12nm process for the I/O die, balancing efficiency and power. Key hardware specs include Cache Hierarchy : 512KB L1, 4MB L2, and a groundbreaking 96MB L3 cache (triple the capacity of non-X3D Ryzen 7 5000 models).
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